Cisco Announces Silicon, Systems, and Optical Innovations at OCP Global Summit 2026
Cisco announced new silicon, systems, and optical innovations at the Open Compute Project (OCP) Global Summit 2026, including plans with NVIDIA to develop the Ultra-Dense Small Form Factor Pluggable (USFP), a 400G-per-lane optical module. The company also unveiled the new Silicon One G302 (51.2T capacity with 1.6T optics and direct-to-chip liquid cooling), confirmed first G300-powered systems are shipping to customers, and disclosed that P200-powered 51.2T systems are in production deployment with Microsoft and...
Key takeaways
Cisco and NVIDIA plan to develop an open USFP industry specification for a 400G-per-lane pluggable optics design, expected to deliver 4x bandwidth density and 1.3x power efficiency vs. 200G-per-lane optics.
Cisco introduced the Silicon One G302, a 51.2T switching silicon with 200G SerDes for top-of-rack deployments, featuring 1.6T optics and direct-to-chip liquid cooling; planned to begin shipping to customers before the end of 2026.
First systems powered by the 102.4T Silicon One G300 are currently shipping to customers.
Cisco is the first in the industry to announce 51.2T Silicon One P200-powered systems in production deployment by hyperscalers, including Microsoft and Alibaba (used in Alibaba's eCORE backbone network).
Cisco announced the Cisco 8001, a Silicon One A100-powered out-of-band management system available in 10G or 1G configurations, running SONiC.
Live Protect for SONiC, using Cisco runtime technology to reduce vulnerability exposure windows, is planned for Cisco SONiC customers starting mid-year 2027.
No financial results, revenue, EPS, margin, cash flow, or forward guidance figures were disclosed in this announcement.
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